The wafer packaging machine is controlled by two frequency converters, the length of the bag can be set at any time and cut at any time, no need to adjust the idling, and it can be done in one step, which not only saves time but also saves packaging film. It is mainly suitable for the packaging of various solid products such as bread, candy and biscuits.
Wafer Packing Machine Features:
1. The surface of the wafer packing machine frame and the parts in contact with materials are made of stainless steel, which is convenient for cleaning and disinfection.
2. The filling and measuring mechanism of the vibrating disc will not throw the material out of the measuring disc during the production process, which avoids the phenomenon of material splashing, and meets the requirements of GMP.
3. During the packaging process, the materials are discharged from the silo in turn, without repeated scraping, which avoids the damage of material particles.
Wafer Packaging Machine Advantages:
1. Full servo intelligent drive control, low noise and smooth operation, more comfortable production environment;
2. High degree of automation, the whole process of feeding, forming, filling and sealing is fully automatic;
3. Equipped with high-speed automatic film bonding function to realize automatic film change without stopping;
4. Humanized design, using industrial touch screen, man-machine dialogue operation, intuitive parameter display, menu operation, more convenient to use;
5. Connecting the assembly line, the whole process from raw materials to finished products realizes automatic sorting and automatic packaging, which greatly improves the production efficiency;
6. Unique structure design, frequency conversion speed regulation, photoelectric color mark automatic tracking;
7. High-precision and durable cutting tools, super-finishing horizontal sealing and vertical sealing.
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